Surface acoustic wave device and method for manufacturing the same

摘要

A surface acoustic wave device (19) includes a package (9) having an element mounting surface (10b), a surface acoustic wave element (1) provided in the package and having at least one bonding electrode (5-8), an adhesive (11) arranged such that the surface acoustic wave element (1) is fixed to the element mounting surface (10b) of the package (9), and at least one bonding wire (12,13) connected to the at least one bonding electrode (5-8). The at least one bonding electrode (5-8) has at least one line-shaped through hole (5a-8a) extending therethrough at a region where the at least one bonding wire (12,13) is connected to the at least one bonding electrode (5-8).