发明名称
摘要 A structure having a first part and at least one second part. The second part is electrically insulated from the first part and the parts are formed in the same wafer of a material. The first and second parts have the same thickness, extend in the same plane and have at least one mutually adjacent edge. The adjacent edges are separated by a spacing. In addition there is at least one joint of insulating material arranged in the spacing to make the first and second parts integral. The structure may be used for sensors and isolated circuits.
申请公布号 JP2000516544(A) 申请公布日期 2000.12.12
申请号 JP19980516287 申请日期 1997.10.01
申请人 发明人
分类号 G01L1/18;B81B3/00;B81C1/00;G01P15/08;(IPC1-7):B81C1/00;H01L27/04;H01L21/822 主分类号 G01L1/18
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