发明名称 Method of fabricating landing pad
摘要 A method of fabricating a landing pad. A gate electrode is formed on a substrate. The gate electrode has a top surface covered by a cap layer and a sidewall covered by a spacer. A polysilicon layer is formed to cover the gate. Using an oxygen based etchant to performed an isotropic chemical dry etching on the polysilicon layer, the polysilicon layer is planarized until a part of the spacer is exposed. The polysilicon layer is patterned to form a landing pad in contact with the substrate.
申请公布号 US6159843(A) 申请公布日期 2000.12.12
申请号 US19990328981 申请日期 1999.06.09
申请人 WORLDWIDE SEMICONDUCTOR MANUFACTURING CORP. 发明人 LIN, CHINGFU
分类号 H01L21/60;H01L21/768;H01L21/8242;(IPC1-7):H01L21/476;H01L21/44;H01L21/302;H01L21/824 主分类号 H01L21/60
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