发明名称 |
Method of fabricating landing pad |
摘要 |
A method of fabricating a landing pad. A gate electrode is formed on a substrate. The gate electrode has a top surface covered by a cap layer and a sidewall covered by a spacer. A polysilicon layer is formed to cover the gate. Using an oxygen based etchant to performed an isotropic chemical dry etching on the polysilicon layer, the polysilicon layer is planarized until a part of the spacer is exposed. The polysilicon layer is patterned to form a landing pad in contact with the substrate.
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申请公布号 |
US6159843(A) |
申请公布日期 |
2000.12.12 |
申请号 |
US19990328981 |
申请日期 |
1999.06.09 |
申请人 |
WORLDWIDE SEMICONDUCTOR MANUFACTURING CORP. |
发明人 |
LIN, CHINGFU |
分类号 |
H01L21/60;H01L21/768;H01L21/8242;(IPC1-7):H01L21/476;H01L21/44;H01L21/302;H01L21/824 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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