发明名称 Method of manufacturing semiconductor device
摘要 In a method of manufacturing a semiconductor device which has a semiconductor substrate, a channel layer formed on the semiconductor substrate and an insulating film deposited on the channel layer, an opening corresponding to a gate electrode pattern is formed in the insulating film by the use of a photoresist film. The channel layer contains crystal components while the photo-resist film contains carbon. The insulating film is etched to exposed said channel layer after removing the photoresist film. In consequence, no reacted production is formed between the crystal components and the carbon on the exposed channel layer.
申请公布号 US6159861(A) 申请公布日期 2000.12.12
申请号 US19980141328 申请日期 1998.08.27
申请人 NEC CORPORATION 发明人 ASAI, SHUJI;OIKAWA, HIROKAZU
分类号 H01L21/285;H01L21/335;H01L21/338;H01L29/10;(IPC1-7):H01L21/302 主分类号 H01L21/285
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