SHEET FOR SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To obtain a sheet for a semiconductor wafer having excellent expansion balance in the MD direction (direction of flow of sheet) and that in TD direction (direction of width of sheet) even in expansion at a room temperature and hardly causing a cutting waste. SOLUTION: In this sheet for a semiconductor wafer having a sheetlike substrate and an adhesive mass layer laminated to one side of the substrate, the substrate comprises 100 pts.wt. of an ionomer resin obtained by crosslinking a carboxyl group-containing compound with a cation and 10-100 pts.wt. of an octene-containing copolymer.