发明名称 |
Semiconductor packages having split die pad |
摘要 |
A semiconductor package including a semiconductor chip having a plurality of bonding pads, a die pad onto which the chip is mounted using a non-conductive adhesive, and a lead frame formed so as to have a plurality of inner and outer leads connected electrically to the bonding pads. The die pad is split into two or more segments, which are coupled together through a non-conductive connector.
|
申请公布号 |
US6160307(A) |
申请公布日期 |
2000.12.12 |
申请号 |
US19950512014 |
申请日期 |
1995.08.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWEON, YOUNG DO |
分类号 |
H01L23/04;H01L23/02;H01L23/48;H01L23/495;H01L23/50;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|