Method and system for detecting faults in a flip-chip package

摘要

A system and method for detecting at least one fault in at least one circuit of a flip-chip package is disclosed. The circuit located on a first portion of a semiconductor die. The method and system include the steps of thinning the semiconductor die without destroying the at least one circuit. The method and system further include applying a liquid having a high evaporation rate in a layer on at least a portion of an exposed surface of the semiconductor die after thinning and applying power to the at least one circuit. The method and system also include determining where at least one portion of the liquid has evaporated from the exposed surface of the semiconductor die to detect the at least one fault.