| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating treatment device which is capable of rapidly injecting a plating liquid to a plating tank without the dissolution of the ground surface of a semiconductor wafer. SOLUTION: This device is provided with a plating cup 21 which is a hollow cup to house a wafer 1, has an aperture in its bottom, is arranged with an anode electrode 24 at its internal center and has a supply piping 22 for supplying a plating liquid and a discharge piping 23 for discharging the plating liquid in its upper part. The device has a base surface 27 which has a cathode electrode to be loaded with the wafer 1 in contact therewith and internally houses the wafer 1 by lifting at the bottom of the plating cup 21 and sealing the aperture. The device has a storage tank 30 which circulates the plating liquid by supplying the plating liquid from the supply piping 22 to the plating cup 21 and recovering the plating liquid from the discharge piping 23 and a supply tank 10 which is arranged in the upper part of the plating cup 21, stores a prescribed volume of the plating liquid supplied from the storage tank 30 and rapidly supplies the plating liquid from the upper part into the plating cup 21.
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