| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the amt. of a binder by preliminarily bringing a large number of chips into contact with a liquid material to impregnate the porous parts of them with the liquid material, and mixing these impregnated chips with a binder to cure the resulting mixture to bond the chips before removing the liquid material remaining in the porous parts. SOLUTION: A large number of porous chips 13 are preliminarily brought into contact with a liquid material 18 to impregnate the porous parts of the individual porous chips 13 with the liquid material 18 and the porous chips 13 impregnated with the liquid material 18 are mixed with a binder 16 to cure the binder 16 to bond the porous chips 13. Herein, as the porous chips, a ground material with a predetermined size obtained by preliminarily grinding various porous resin, rubbers or wood pieces or sawdust is used. As the binder, moisture curable polyurethane is pref. used but other thermosetting polyurethane or a rubbery adhesive can be also used.</p> |
