DEVICE AND METHOD OF MANUFACTURING METALLIC BASE PLATE FOR CIRCUIT

摘要

PROBLEM TO BE SOLVED: To obtain a circuit pattern base plate of large thickness by pressing an upper stage set being arranged oppositely to a bottom stage set, on which a lead frame is to be mounted, for moving it in the bottom stage direction and by pressure fastening the lead frame so as to cut its unnecessary portion. SOLUTION: A bottom stage 4 is moved from a position directly below the upper stage 2 and a working element is mounted on the bottom stage 4 with an usage of position matching pins 6. The working element is absorbed from a vacuum absorption hole 5 of a bottom cutting blade 3 and is fastened. The bottom stage 4 is moved to a position directly below the upper stage with a rail 11 for pressing and fastening the working element on the bottom cutting blade 3 by lowering the upper stage 2. An upper cutting blade 1 of the upper stage 4 is further lowered for engaging with the bottom cutting blade 3 so that the working element on the bottom cutting blade 3 and the working element on the bottom stage 4 are cut/separated. The bottom stage 4 is pulled out by rising the upper stage 2 so that the necessary circuit pattern alone is left remained on the bottom cutting blade 3.