发明名称 MANUFACTURE OF URETHANE MOLDING FOR POLISHING PAD, AND URETHANE MOLDING FOR POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To improve the polishing characteristic of a polishing pad and to reduce the dispersion of the polishing characteristic of polishing pads by mixing the specific quantity of water in a mixture of expanded micro hollow spheres, an isocyanate radical end urethane prepolymer and an active hydrogen contained compound to form bubbles by water. SOLUTION: Water is mixed at 0.005-0.5 wt.% in a mixture of expanded micro hollow spheres, an isocyanate radical end urethane prepolymer and an active hydrogen contained compound to form bubbles by water in a molding. The expanded micro hollow spheres are formed by expanding unfoamed heat- expansive micro spheres formed out of thermoplastic resin, by heating. The isocyanate prepolymer is a reactant obtained from polyol or a mixture of polyol and low molecular weight diol, and an organic diisocyanate compound under normally applied reaction conditions. 3, 3'-dichloro-4,4' diaminophenylmethane or the like is used as the active hydrogen contained compound.
申请公布号 JP2000343412(A) 申请公布日期 2000.12.12
申请号 JP19990157420 申请日期 1999.06.04
申请人 FUJI SPINNING CO LTD 发明人 KIHARA KATSUSHI;MOCHIZUKI YOSHIMI
分类号 B24B37/20;B24B37/24;C08G18/00;C08G18/10;C08G18/32;C08J5/14;C08J9/12;C09K3/14;H01L21/304 主分类号 B24B37/20
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