| 摘要 |
PROBLEM TO BE SOLVED: To prevent puncture of insulation of a dielectric film resulting in scattering of the film in the form of particles by preventing the dielectric film adhered to an adhering protection board from being electrostatically charged when the dielectric film is formed by a sputtering device. SOLUTION: An adhering protection board 19 is floated against upper and lower electrodes 5, 6 and a container 2, and at the backside of the board 19, sealed electrode 11 connected with a container 2 at a narrower spacing than sheath thickness is located so that electrical discharge may not occur between the sealed electrode 11 and the container 2 and also electrical discharge may not occur between the adhering protection board 19 and sealed electrode 11.
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