Array type multi-chip device and fabrication method therefor

摘要

An array type multi-chip device and a fabrication method therefor form a plurality of devices of the same kind or different kinds into a single chip. The array type multi-chip device includes: an array type sintered body in which a plurality of unit devices are arranged such that internal electrodes of each of the unit devices are exposed at opposite side surfaces of the array type sintered body; glass pastes formed at portions of the side surfaces of the array type sintered body between the internal electrodes of the adjacent unit devices; external electrodes of conductive paste formed to cover the internal electrodes at the surfaces of the sintered body between the adjacent glass pastes and overlapping the glass pastes; and nickel and solder platings formed on surfaces of the external electrodes.