发明名称 Power semiconductor packaging
摘要 Power output switching circuit for use in high current and high frequency applications. The output circuit provides a series of geometrically symmetric, parallel spaced semiconductor converters arranged such that the voltage for each semiconductor output device is substantially the same impedance, such that circuit performance is largely a function of intrinsic device characteristics, and substantially independent of cross coupling and other external influences.
申请公布号 US6160326(A) 申请公布日期 2000.12.12
申请号 US19990460784 申请日期 1999.12.14
申请人 IVERSEN, ARTHUR H.;GABOR, GEORGE 发明人 IVERSEN, ARTHUR H.;GABOR, GEORGE
分类号 H01L23/467;H01L25/07;H01L25/11;H01L25/16;H02M7/00;(IPC1-7):H01L25/00 主分类号 H01L23/467
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