发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a composition which has no halogenated epoxy resin and Sb2O3 and shows excellent moldability, high flame retardancy and reliability by making the composition contain an epoxy resin, a phenolic resin hardening agent, a microcapsule type flame retardant obtained by coating a core material containing red phosphorous as a major component with a thermoplastic resin and/or a thermosetting resin, a molybdenum compound and an inorganic filler. SOLUTION: A content of red phosphorous in a core material of a microcapsule to be used is preferably 60 to 99.5 wt.%, particularly 80 to 99 wt.%. The microcapsule particle preferably has an average diameter of 0.1 to 100μm, preferably 0.2 to 40μm, particularly 0.5 to 20μm in view of flame retardancy, dispersibility, workability (low viscosity of the composition) and the like. The molybdenum compound is preferably zinc molybdate or zinc molybdate supported on an inorganic filler.
申请公布号 JP2000345009(A) 申请公布日期 2000.12.12
申请号 JP20000077587 申请日期 2000.03.21
申请人 SHIN ETSU CHEM CO LTD 发明人 OSADA MASAKAZU;ASANO HIDEKAZU;INO SHIGEKI;AOKI TAKAYUKI;TOMIYOSHI KAZUTOSHI;SHIOBARA TOSHIO
分类号 C08L63/00;C08G59/62;C08K3/00;C08K3/02;C08K3/24;C08K9/02;C08K9/10;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08L63/00
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