发明名称 |
LOOP HEAT INSULATING DEVICE FOR PLATE THICKNESS REDUCTION PRESS |
摘要 |
PROBLEM TO BE SOLVED: To provide a loop heat insulation device for a plate thickness reduction press which can prevent a heat dissipation within loop facilities during forming and carrying the loop, minimize a heat insulation capacity and contrive an energy saving by improving a heat insulation effect. SOLUTION: This device is provided with a plate thickness reduction press 33 for molding a continuous cast slab into a given thickness plate slab by using a pair of upper and bottom dies, and a loop forming device 37 arranged freely elevatably between a finish rolling group 34 which is arranged at a down stream side of the plate thickness reduction press for continuously rolling the plate thickness slab into a given thickness rolled material. This loop forming device has an elevatable or p fixed heat insulation cover 35 and a heat insulation device 36 for heat insulation of the plate thickness slab while it is conveying, and is forming a loop.
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申请公布号 |
JP2000343113(A) |
申请公布日期 |
2000.12.12 |
申请号 |
JP19990154600 |
申请日期 |
1999.06.02 |
申请人 |
ISHIKAWAJIMA HARIMA HEAVY IND CO LTD;NKK CORP |
发明人 |
OSADA SHIRO;IWANAMI NORIO;IDE KENICHI;ISHII HAJIME;MIKAMI MASAO;NISHII TAKASHI;MURATA SATOSHI |
分类号 |
B22D11/128;B21B39/12;B21B45/00;B22D11/20;(IPC1-7):B21B45/00 |
主分类号 |
B22D11/128 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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