| 摘要 |
PROBLEM TO BE SOLVED: To make the kinds of liquid for deposition ample and to improve the characteristics of a deposited film. SOLUTION: The degassing of a plating liquid 12 of a plating bath 10 is executed by driving a suction pump 24 to get rid of the air existing in the plating liquid. A flow rate control valve 29 is opened to supply ozone to the plating bath 10 and to dissolve the zone in the plating liquid 12. The plating liquid 12 is thereafter stirred by a stirring machine 15 and potential is impressed between a steel sheet 16 which is a cathode and a copper electrode 18 which is an anode by a DC power source 20, by which metal copper is precipitated on the steel sheet 16 and the copper film is deposited thereon.
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