发明名称 |
Efficient solid-state high frequency power amplifier structure |
摘要 |
A power amplifier uses a plurality of solid-state amplifiers (FIGS. 2 and 3, 140) arranged in a parallel manner to form a power amplifier module (10). Each solid-state amplifier is adhered to a low thermal expansion insert (130). The insert is then coupled to a low cost aluminum substrate in order to carry the excess heat from each solid-state amplifier (140) to the aluminum housing. The power outputs from the solid-state amplifiers from each module are combined with the power outputs from other modules using electroformed waveguide combiners (FIG. 1, 30, 40).
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申请公布号 |
US6160454(A) |
申请公布日期 |
2000.12.12 |
申请号 |
US19980175037 |
申请日期 |
1998.10.19 |
申请人 |
MOTOROLA, INC. |
发明人 |
BUER, KENNETH V.;COOK, DEAN L.;TORKINGTON, RICHARD;STANFIELD, EDWIN J.;DENISUK, PHILLIP JAMES |
分类号 |
H01P5/12;(IPC1-7):H03F3/68;H03F3/14 |
主分类号 |
H01P5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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