| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition which can form a highly flat, cured film even on a substrate having a low surface flatness and can form a cured film having a high surface hardness and excellent heat resistance, chemical resistance, etc., by compounding a (co)polymer containing structural units each having a glycidyl group with another epoxy resin and a compound which generates an acid by heat or radiation. SOLUTION: This curable composition comprises 100 pts.wt. (co)polymer containing at least 20 mol% structural units represented by formula I (wherein R1 is H or 1-5C alkyl; R2 is H or 1-2C alkyl; and m is 1-8) and having a wt. average mol.wt. of 3,000-300,000, 1-200 pts.wt. epoxy resin other than the (co)polymer, and 0.01-20 pts.wt. compound which generates an acid by heat or radiation, If necessary, the composition may further contain ingredients other than above-described. A solution of the composition is applied to the surface of a substrate, prebaked to remove a solvent to form a coating film, and baked to give a cured film. |
