发明名称 Methods of forming nitride dielectric layers having reduced exposure to oxygen
摘要 of A method of forming a dielectric layer includes the steps of forming an electrode on a microelectronic substrate, and forming depressions and protrusions on exposed portions of the electrode thereby increasing a surface area thereof. An exposed portion of the electrode including the depressions and protrusions is nitrified, and the electrode is not exposed to oxygen during and between the steps of forming the depressions and protrusions and nitrifying the exposed portion of the electrode. A nitride layer is then formed on a nitrified electrode. Related structures are also discussed.
申请公布号 US6159849(A) 申请公布日期 2000.12.12
申请号 US19980021005 申请日期 1998.02.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG, SEONG-HUN;KOH, YOUNG-LARK;LEE, JUNG-KYU
分类号 H01L27/04;H01L21/02;H01L21/318;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/44;H01L21/824 主分类号 H01L27/04
代理机构 代理人
主权项
地址