发明名称 METHOD AND DEVICE FOR PLATING
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for plating to attain the shortening of a lead time from the beginning to the end of processing of a substrate corresponding to a production method where each product (or half-finished goods) is completed one after another in succession (one product flow). SOLUTION: In the plating device where plating is carried out with two or more plating processes having adjoining plating tank 37, a transporting mechanism in tank which transports a plated member in each plating tank by a predetermined distance, and a transport mechanism between substrate tanks (10), which transports each plating member one after another to the plating tank for the next process, the number of the plating members immersed into the plating tank are varied correspondingly to the immersion time of the plating process for immersing the member in the plating tank.
申请公布号 JP2000345397(A) 申请公布日期 2000.12.12
申请号 JP19990157586 申请日期 1999.06.04
申请人 YOKOGAWA ELECTRIC CORP;YOKOGAWA FINE TECHNOLOGY CORP;YOKOGAWA IBIDEN COMPONENTS CORP 发明人 AWAJI TERUO;MINESHIMA TOSHIO;FUJIWARA MAKOTO;INOUE YOSHIO
分类号 C25D17/28;(IPC1-7):C25D17/28 主分类号 C25D17/28
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