发明名称 Copper source reagent compositions, and method of making and using same for microelectronic device structures
摘要 Copper precursors useful in liquid delivery CVD for forming a copper-containing material on a substrate. The disclosed copper precursors are particularly useful for metallization of interconnections in semiconductor device structures.
申请公布号 AU5038800(A) 申请公布日期 2000.12.12
申请号 AU20000050388 申请日期 2000.05.22
申请人 ADVANCED TECHNOLOGY MATERIALS, INC. 发明人 CHONG-YING XU;THOMAS H. BAUM
分类号 C07C49/92;C07F1/00;C07F1/08;C07F7/08;C23C16/18;H01L21/28;H01L21/285 主分类号 C07C49/92
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