发明名称 |
Copper source reagent compositions, and method of making and using same for microelectronic device structures |
摘要 |
Copper precursors useful in liquid delivery CVD for forming a copper-containing material on a substrate. The disclosed copper precursors are particularly useful for metallization of interconnections in semiconductor device structures. |
申请公布号 |
AU5038800(A) |
申请公布日期 |
2000.12.12 |
申请号 |
AU20000050388 |
申请日期 |
2000.05.22 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC. |
发明人 |
CHONG-YING XU;THOMAS H. BAUM |
分类号 |
C07C49/92;C07F1/00;C07F1/08;C07F7/08;C23C16/18;H01L21/28;H01L21/285 |
主分类号 |
C07C49/92 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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