| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a chip substrate by which a solder ball for bump connection is easily set. SOLUTION: A partition wall, and interval maintaining member 26, or the like are laminated on a connection part 27 such as an LSI, an electronic circuit, or the like formed on a chip substrate 25. At the time of patterning, a hole 26-1 having a diameter smaller than that of a solder ball 32 is formed at the connection part 27. Furthermore, in laminating, for example, and orifice plate 17, or the like thereon for etching a nozzle, a hole larger than the hole 26-1 of a small diameter, that is, a hole of a substantially same diameter as that of the solder ball 32, is formed thereat as a terminal contact hole 24. By inserting the end part of the chip substrate 25 with the terminal contact holes 24 formed, into the solder balls 32 stored in a container 31 by a large number and pulling it out, the solder balls 32 are set in the terminal contact holes 24. By heat press bonding of a parent substrate with a wiring formed, for example, a flexible printed wiring substrate (FPC) thereon, terminals of the chip substrate and the parent substrate are connected.
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