| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing device capable of polishing a wafer stably and its manufacturing method. SOLUTION: A wafer holding head 1 is provided with a head main body 2, a diaphragm 5 stretched in the head main body 2, a carrier 6 which is fixed on the diaphragm 5, is provided so as to displace in the direction of axial line of the head together with the diaphragm 5, and holds one face of a wafer W, a retainer ring 7 which is concentrically arranged at outer periphery of the carrier 6, is fixed on the diaphragm 5, and is provided so as to displace in the direction of axial line of the head together with the diaphragm 5, and a thin plate 20 like a circular ring fixed on an upper face of the diaphragm 5. The twist acting on the diaphragm 5 when the wafer W is polished is suppressed by the thin plate 20 so that the wafer W is stably polished. |
