| 摘要 |
PROBLEM TO BE SOLVED: To eliminate generation of chipping and flawing in a circuit board at the time of transportation of the circuit board, and to allow continuity inspection for the circuit board to be carried out in a stable posture. SOLUTION: This device 1 is a substrate inspecting device 1 for conducting continuity inspection between a wiring pattern in a surface side of a circuit board 5 and a wiring pattern in its reverse face side, and is provided with the first table 17 for laying the circuit board 5, and advanced and retreated in the rear and front direction the second table 7 for mounting the first table 17, and advanced and retreated along a direction orthogonal to the moving direction of the first table 17, the first driving means 18 for driving the first table 17 the second driving means 8 for driving the second table 7, a probe insertion opening 27 formed in the first table 17, closed by the substarte 5, and for exposing the wiring pattern in the reverse face side of the circuit board 5, and a stopper means 40 for regulating the maximum moving limit of the probe insertion opening 27 with respect to an under-side probe 30 projected inside the opening 27 to contact with the wiring pattern.
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