| 摘要 |
PROBLEM TO BE SOLVED: To mount an electronic component on a substrate, so that it does not fall from the substrate by detecting the distance between the surface of the substrate and a head with measuring equipment, to calculate the fall distance of the head and then crushing the heads of bumps by lowering the head to uniform the height of the bumps from the surface of the substrate. SOLUTION: A stage 4 is disposed in parallel with a head 2. Each of the head 2 and the stage 4 has a built-in heater. A wiring board 11 provided with solder bumps 12 is set on the stage 4. Then, the head 2 is lowered, to be brought into contact with the solder bumps 12 and then is further lowered to apply pressure to the wiring board. The when the heads of the solder bumps 12 are crushed and a load reaches one for correcting the warpage of the wiring board 11, the lowering of the head 2 is stopped, and the height of the wiring board 11 is measured by a noncontact type displacement gauge 1. Based on the measurement result, the height of the heated solder bumps 12 from the surface of the wiring board 11 is fixed. With this method, there will not be an electronic component falling from the wiring board 11, and a connection faults or other problems can be prevented.
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