| 摘要 |
PROBLEM TO BE SOLVED: To execute signal transmission of high speed between a measuring board and a semiconductor to be measured without using a jig by electrically conducting a conductive pad to a measuring pattern through a linear material packed inside a through hole. SOLUTION: A through hole is formed on a measurement board corresponding to a measurement point 5 (soldered bump) of a semiconductor to be measured 1. For example, a conical conductive pad 6 is mounted on the side of the semiconductor 1 to be measured of the through hole, a linear material 7 made of a conductor is packed inside the through hole, and the conductive pad 6 is electrically conducted to a measurement pattern through the linear material 7. The conductive pad 6 and the linear material 7 are made of gold. By applying this structure, as a top part of the through hole is sealed by the conductive pad 6 to obtain the function of a socket, and the measuring jig is not used, an excess contact point does not exist between the semiconductor 1 to be measured and the measurement board, and the electric length can be shortened. Whereby the signal delay in the high-speed measurement of semiconductor product can be prevented.
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