| 摘要 |
PROBLEM TO BE SOLVED: To provide a module for IC card, in which the height of an IC module is low and the warp and the projecting/recessed part of the IC module owing to the change of a temperature can be suppressed, and to provide the manufacturing method. SOLUTION: The gold bump 4 of an IC element 3 and a silver plating part given to a lead frame 6 are directly jointed by ultrasonic wave welding and sealing resin 5 is arranged at a periphery. Sealing resin is uniformly arranged on the upper face part and the lower face part of the IC element 8. When the difference of the linear expansion coefficients of sealing resin 5 and the lead frame 6 is selected to be within a range from -50 deg.C to 180 deg.C and to be within 10%, the warp and the bend of the IC module 2 hardly occur. |
