发明名称 COMPOSITE MODULE AND PRINTED CIRCUIT BOARD UNIT
摘要 PROBLEM TO BE SOLVED: To shorten the wiring length between MCMs(multichip modules) by mounting the functional parts which control the input and output signals of the first MCM on a flexible substrate. SOLUTION: Two MCMs 1 are separately mounted on a mother board 12 to electrically connect the board 12 through input-output pins 4. Between the MCMs 1, a flexible substrate 30 is arranged in a state where the substrate 30 is sandwiched between the MCMs 1, and both ends of the substrate 30 are brought into contact with a multilayered thin film circuit 25 formed on the upper surfaces of the substrates of the MCMs 1. On the center of the flexible substrate 30, an interface LSI chip 40 is mounted. Therefore, the wiring length between the MCMs 1 can be shortened.
申请公布号 JP2000340917(A) 申请公布日期 2000.12.08
申请号 JP19990146657 申请日期 1999.05.26
申请人 FUJITSU LTD 发明人 MORIIZUMI KIYOKAZU;OSAWA TAKUMI
分类号 H01L23/538;H01L25/065;H05K1/14;H05K1/18;H05K3/36 主分类号 H01L23/538
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