| 摘要 |
PROBLEM TO BE SOLVED: To avoid improper connection of a conduction path consisting of a plurality of conduction paths that are formed by continuing partial holes formed in advance in a plurality of dielectric sheets laminated with each other in a laminating direction and absorptively coating electrode paste to the inner face. SOLUTION: Dielectric sheets 2a-2g except a dielectric sheet 2h at the lowermost layer are laminated, each partial hole 10 continued in a laminating direction to configure a partial laminated product 20, electrode paste is absorptively coated to the inner face of the continuous partial hole 11 to form a 1st conductive layer 25. Then the dielectric sheet 2h at the lowermost layer is placed at the lower face of the partial laminated product 20, the partial hole 10 of the dielectric sheet 2h is matched with the continuous partial hole 11, through conduction paths, I, O, G are formed and the electrode paste is absorptively coated to form a 2nd conduction layer 25b and they are integrally baked.
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