| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting structure in which occurrence of failure such as cracks, breakages of wirings, etc., in a metal wiring on a semiconductor IC chip is suppressed in an IC element of a facedown mounting structure, and the IC element comprising the mounting structure. SOLUTION: Bumps 3 are provided on the terminal on the surface of an IC chip 1 with respect to the wiring and terminal formed on a board 2, and a surface provided with the wiring and the terminal on the board 2 and a surface provided with the bump 3 of the IC chip 1 are bonded to each other using anisotropic conductive bonding agent or an anisotropic conductive bonding film. In am IC element of a facedown mounting structure that electrically connects both terminals, a means 8 for preventing distortion of board is annexed to a site corresponding to the vicinity of an end part of the IC chip 1 on the board 2.</p> |
