| 摘要 |
<p>PROBLEM TO BE SOLVED: To supply an even amount of flux over the entire part which requires solder by jointing a connection electrode of a printed board to a solder bump of an LSI while the oxide film on the surface of a pre-solder of the printed board and the solder bump of LSI is removed and cleaned. SOLUTION: A solder bump 4 of an LSI1 is soldered to a pre-solder 5 provided on a connection electrode 6 of a printed board 2 so that the LSI1 and the printed board 2 are electrically connected together. Here, the surface oxide film of the pre-solder 5 provided on the connection electrode 6 of the printed board 2 and the solder bump 4 of the LSI1 is removed and cleaned, and, in order to provide good soldering, a flux sheet 3 which holds the LSI1 is used during transportation after mounting of the LSI1 to the printed board 2. Thus, no facility or jig, etc., is required, and an even amount of flux is supplied over the entire surface which requires soldering.</p> |
