| 摘要 |
PROBLEM TO BE SOLVED: To reduce the possibility of generating defective contact because the surface of a contact terminal is oxidized or the plating of the surface is deteriorated by sticking a film for preventing the leakage of resin for sealing onto the contact terminal for transmitting information. SOLUTION: For example, a lead frame material 4 for an IC card consisting of a Cu bar is prepared, this material 4 is formed in a prescribed shape by punching or etching to manufacture a lead frame 5 for the IC card and the surface of this frame 5 is plated with Au or the like 6. Next, a prescribed lead frame 16 for the IC card is manufactured by continuously sticking belt-like resin films such as polyethylene terephthalate, polypropylene as a film 14 for preventing leakage of resin for sealing at the time of sealing resin onto a contact terminal 3 for transmitting information on a surface on a side opposite to a surface on a side to which the semiconductor chip of the frame 5 is mounted. It is desirable that this resin film material is well suited to the resin for sealing 12 to be stuck and to be easily separated. |
