CONNECTING METHOD FOR IC CHIP AND MANUFACTURE OF LIQUID- CRYSTAL DEVICE

摘要

PROBLEM TO BE SOLVED: To improve reliability of conductive connection by applying almost uniform thrust to individual IC side terminal, when the IC chip of a structure in which a center line for a bump of the IC chip is deviated from a center line of an external shape of the IC chip is mounted on a substrate. SOLUTION: In this connecting method for an IC chip, a bump 2 provided to the IC chip 1 and a substrate-side terminal 6 provided to substrate 4a are conductively connected. Further more, in the connecting method, the IC chip has a structure, where the bump 2 forms a pair of terminal rows R1 and R2 facing each other and further a center line L1 between the terminal rows R1 and R2 deviates from a center line L0 of an external shape of the IC chip. A material 17 for bonding is inserted between the IC chip 1 and the substrate 4a, and the IC chip 1 is thrust by a pressurizing head 22 under a condition, where a thrust center line L2 of the pressurizing head 22 corresponds almost to the center line L1 between the bump rows. Substantially uniform thrust is applied to each bump 2.