发明名称 ULTRASONIC TRANSDUCER FOR BONDING DEVICE AND MANUFACTURE THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To miniaturize a base end in an ultrasonic transducer provided in a bonding device. SOLUTION: A first hollow portion 100 communicating with a rear end aperture is formed at a base end portion of a horn body 12, and an internal unit 14 is disposed therein. The internal unit 14 is constituted by a vibrator 16 and a pressing block for pressing and fixing the vibrator. A through-hole is formed in the central portion of the internal unit 14. A second hollow portion 102 and a third hollow portion 104 are formed in the horn body 12. A signal line can be led from the inside of the vibrator 16. As a result, the outer shape of the base end portion can be simplified and miniaturized. Since the vibrator 16 is housed inside, the vibrator 16 can be protected from thermal influences.</p>
申请公布号 JP2000340600(A) 申请公布日期 2000.12.08
申请号 JP19990149629 申请日期 1999.05.28
申请人 SHINKAWA LTD 发明人 SAKAKURA MITSUAKI
分类号 H01L21/60;B06B3/00;B23K20/10;H01L21/607;(IPC1-7):H01L21/60 主分类号 H01L21/60
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