发明名称 SEMICONDUCTOR MODULE AND METHOD OF CONNECTING THE SAME
摘要 PROBLEM TO BE SOLVED: To reduce the thickness of the whole module and to directly attach and detach a socket of a PC board by arranging a first lead group at one end of the module, such that the upper surfaces of leads are exposed to such end, and a second lead group at the other end in a manner projecting from a package. SOLUTION: A single body of module 10 has a first lead group 11 arranged at one side end thereof, in such a manner that the upper surfaces of leads 11a are exposed to the side end, and a second lead group 12 arranged at the other end in a manner projecting from a package 13. The leads 11a belonging to the group 11 are arranged at an equal interval along the length of the package 13. Leads 12a belonging to the group 12 are arranged at the same pitch as the leads 11a along the length of the package 13. Since the leads 12a are arranged linearly in this manner projecting from the package 13, terminals of the module 10 can be used as terminals for attaching sockets.
申请公布号 JP2000340742(A) 申请公布日期 2000.12.08
申请号 JP19990148481 申请日期 1999.05.27
申请人 NEC CORP 发明人 ICHISE MASAHIKO
分类号 H01L25/10;H01L25/18;(IPC1-7):H01L25/10 主分类号 H01L25/10
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