| 摘要 |
PROBLEM TO BE SOLVED: To improve productivity and to maintain stable operating efficiency by efficiently performing one-by-one carry-in/carry-out of a semiconductor work and wire bonding work, and to form into small and compact size. SOLUTION: A semiconductor work is thrown in a work holding part 3 of a stage unit 4 one by one with a work carry-in/carry-out mechanism part 2. Here the semiconductor work is positioned, and further it is heated up to a prescribed temperature, and then rotated in a 180-degree arc by a rotating mechanism part 9 of the stage unit 4 to move to a bonding unit 6 side. After it is clamped by a clamper 7, a prescribed wire bonding work is performed with a capillary 19 of the bonding unit 6. During this work, a next semiconductor work is thrown in another work holding part 3. The semiconductor work that has already wirebonded is carried out to a next process side by work carry-in/carry-out mechanism part 2 engaging with the work holding part 3, that is rotated in a 180-degree arc to be returned to the original position. |
