发明名称 WAFER PACKAGING AND STORING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To protect wafers from the outside air and light and prevent them from receiving disturbances, by covering and wrapping with a conductive sheet having a shading quality the whole outer surface of the two sheets of adhered wafers, and by storing in a container the two sheets of adhered wafers covered and wrapped with the conductive sheet. SOLUTION: Wafers 1 for clealiness analysis are so left as they are during several hours to several days in the checked region of a clean room to be a checked object as to expose them to the atmosphere of the clean room. That is, surface portions 2 of the two sheets of wafers 1 are superimposed on each other in the atmosphere of the checked region. Then, after covering and wrapping with a metallic foil 3 of a conductive sheet having a shading quality the whole outer surfaces of the two sheets of wafers 1 whose surface portions 2 are adhered to each other, the two sheets of adhered wafers 1 covered and wrapped with the metallic foil 3 are stored in a main body 5 of a wafer container 4 to seal them adhesively by a container cover 6. As a result, the wafers 1 are protected from the outside air and light, etc., to prevent them from receiving disturbances.</p>
申请公布号 JP2000340643(A) 申请公布日期 2000.12.08
申请号 JP19990148748 申请日期 1999.05.27
申请人 NEC KYUSHU LTD 发明人 FUJITA YASUHIRO
分类号 B65D85/86;H01L21/673;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65D85/86
代理机构 代理人
主权项
地址