| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device where a scribe line can be lessened in line width, and a chip can be lessened in size by a method, wherein the corner of the scribe line is used effectively for forming the device. SOLUTION: Bonding pads 3 are arranged outside an intra-chip circuit region 2 of a semiconductor integrated circuit substrate 1, and scribe lines 4 are provided outside the bonding pads 3 for separating chips. A corner section 4a of the scribe line 4 is formed wider than other parts, and a wafer testing circuit 5 and testing pads 6 are formed in the corners 4a.</p> |
