| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin shape and high heat dissipation by cover coating a circuit pattern on a film, on which bond fingers and ball lands are positioned, and by sealing a part of a circuit substrate on which a semiconductor chip is positioned in a central penetrating hole, input/output pads and bond fingers, while making conductive balls fusion bond to the ball lands. SOLUTION: A semiconductor package 101 has a semiconductor chip, having a first plane 30a on which a plurality of input/output pads 31 are formed and a second plane 30b on its lower and upper parts, respectively. The semiconductor chip 30 is bigger than the area of the first or the second plane 30a, 30b, and is positioned inside a through-hole 12. The circuit substrate 10 has a through-hole 12 at a region where the semiconductor chip 30 is positioned, centered in a thin film 17 having a first plane 11a and a second plane 11b on its lower and upper parts, respectively. On the first plane 11a which is outside of the through- hole 12 in the film 17, conductive circuit patterns 18 containing ball lands 18b are formed. The patterns 18 are thin films of conductive copper, and a series of bond fingers 18a and of ball lands 18b are arranged in that order from the vicinity of the through-hole 12. |
