| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition excellent in resolution, adhesion of a thin line, low plating bath contamination, chemical resistance and flexibility, to obtain a photosensitive element and to produce a resist pattern. SOLUTION: The photosensitive resin composition contains (A) a polymer binder, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule, (C) a 2,4,5-triarylinnidazole dimer and (D) a sulfonium-boron salt compound. The photosensitive resin composition is applied on a support and dried to obtain the objective photosensitive element. The photosensitive element is laminated on a substrate for forming a circuit in such a way that the photosensitive resin composition layer adheres closely to the substrate and the layer is imagewise irradiated with active light. The exposed part is photoset and the unexposed part is removed by development to produce the objective resist pattern. The substrate for forming a circuit with the produced resist pattern is then etched or plated to produce the objective printed circuit board. |
