| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent generation of cracks or peelings in an insulating substrate to which a metal plate is adhered and enhance its heat dissipation capability by constituting the insulating substrate with a laminate of an insulating layer of a high thermal expansion coefficient and insulating layers of a low thermal expansion coefficient, while one of the low thermal expansion coefficient insulating layers is arranged on the metal-plate jointing plane in the insulating substrate. SOLUTION: A ceramic wiring substrate 1 is constituted by adhering a metal plate 3 on a specified position of a surface 2a of a ceramic insulating substrate 2 via an adhesion layer 4. On the surface and/or inside of the ceramic insulating substrate 2, wiring circuit layers 5 and through-hole conductors 6 mainly composed of metals that are capable of being fired simultaneously with ceramics such as tungsten, molybdenum or copper which are to be used to form general wiring circuits, are formed. The insulating substrate 2 in the wiring substrate 1 is constituted of a laminate of a high thermal expansion coefficient insulating layer 7 and low thermal expansion coefficient insulating layers 8. By arranging one of the low thermal expansion coefficient layers 8 on the metal-plate adhesion plane 2a, compression stress is generated on the metal-plate jointing plane 2a of the insulating substrate 2, and suppresses the generation of cracks or the like in the metal-plate jointing part.</p> |
