SEMICONDUCTOR LAMINATED PACKAGE, SEMICONDUCTOR PACKAGE UNIT AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To increase mounting density and reduce manufacturing cost and increase the yield of manufacturing processes. SOLUTION: A semiconductor package unit 10 comprises a semiconductor IC chip 11, a sealing resin body 15, and external connection terminals 14a, 14b. The semiconductor IC chip 11 has a principal plane and a sidewall and includes bonding pad electrodes 12a, 12b formed on the principal plane. The sealing resin body 15 is formed on the principal plane of the semiconductor IC chip so as to cover the bonding pad electrodes. The sealing resin body 15 has a sidewall which is substantially flush with the sidewall of the semiconductor IC chip. The external connection terminals 14a 14b are electrically connected to the bonding pad electrodes, being formed on the sidewall of the sealing resin body 15.