| 摘要 |
PROBLEM TO BE SOLVED: To prevent the land of a substrate side colliding with a probe unit from damaging the probe at the time of inspecting the substrate for mounting semiconductor chip. SOLUTION: An inspection probe installation part 6, where an inspection probe 5 is arranged at the uppermost layer member 8 of a probe unit 3, is installed in a peripheral edge part 7 surrounding the inspection probe installation part 6 in a recessed state. A recessed depth D is set to smaller than the initial protruding direction height (full stroke) S of the inspection probe 5, so that a solder ball 9 is not brought into contact with the edge 10a of a probe support hole 10, when a substrate 1 collides with the peripheral edge part 7. Since the part surrounding the part, where the inspection probe 5 of the probe unit 3 is installed, collides with the substrate 1 first, the part where the inspection probe 5 is arranged is prevented from colliding with the substrate 1. Then, the terminal of a substrate side is prevented from colliding with the edge of the hole supporting the inspection probe and the edge from being damaged.
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