发明名称 SUBSTRATE INSPECTING DEVICE
摘要 PROBLEM TO BE SOLVED: To execute the inspection without damaging a part to be measured and to reduce the cost of a product by enabling an inspection probe for contact inspecting a substrate to be contacted with and separated from the part to be measured, and mounting a contact impact reducing means. SOLUTION: This substrate inspecting device 1 executes the continuity test of a wiring pattern of a circuit board 2 provided with the predetermined wiring pattern, and an inspection probe 3 is contacted with a part to be measured of the circuit board 2 to inspect the substrate. In the inspection, the inspection probe 3 comes into contacted with and separates from the part to be measured by a servo motor 4, and the impact in the contact is reduced by an impact reducing means 5. The impact reducing means 5 consists of compression coil springs 10, 11, 12, a shaft member 13, a stopper member 14 and the like, and the inspection probe 3 mounted on a block 8 is temporarily stopped, and then brought into contact with the part to be measured of the circuit board 2 by the functions of these members. Whereby the impact can be remarkably reduced, and the part to be measured can be prevented from being damaged.
申请公布号 JP2000338130(A) 申请公布日期 2000.12.08
申请号 JP19990152184 申请日期 1999.05.31
申请人 NIDEC COPAL CORP 发明人 KATO EIICHI
分类号 G01R31/28;G01R1/06;G01R31/02;(IPC1-7):G01R1/06 主分类号 G01R31/28
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