| 摘要 |
PROBLEM TO BE SOLVED: To provide a fuse incorporated in semiconductor integrated circuit, in which a fuse element can be cut without adversely affecting an adjacent fuse element at irradiation of laser for cutting. SOLUTION: A fuse element FUSE is a conduction film, which is arranged in a fuse region installed in a semiconductor integrated circuit system and is cut by a laser at changeover of the circuit. The fuse element FUSE has a surface, where positions at end parts in a direction crossing a longitudinal direction are high and are lower toward a center in a main body form, whereas it is a rectangular parallelopiped in the conventioned cases. At cutting of the fuse by a laser beam outputted from a laser repair device, adverse influences on the adjacent fuse is suppressed by the bent from of the upper face of the fuse element. At laser irradiation, the dispersion of energy to the outer side of the fuse element is suppressed, and the energy absorption of the laser is increased.
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