发明名称 FIXING STRUCTURE AND METHOD FOR BALL GRID ARRAY CASE
摘要 PROBLEM TO BE SOLVED: To provide a fixing structure and a fixing method for a ball grid array case preventing a short circuit between neighboring bumps, and surely connecting a BGA case to a PWB. SOLUTION: In a fixing structure for a ball grid array(BGA) case soldered to a PWB(printed wiring board) 4 through a bump 3, a fixing pin 1 is projected from the ball grid array case 2, a pin hole 6 is provided through the PWB 4, the fixing pin 1 is inserted into the pin hole 6, and the ball grid array case 2 and the PWB 4 are fixed each other.
申请公布号 JP2000340271(A) 申请公布日期 2000.12.08
申请号 JP19990150923 申请日期 1999.05.31
申请人 NEC KOFU LTD 发明人 KASAI SHUJI
分类号 H01R4/02;H01L21/60;H01R13/46;(IPC1-7):H01R4/02 主分类号 H01R4/02
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