| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable semiconductor device, on which semiconductor pellets can be mounted with a solder having a constant thickness, by making notch grooves in islands and setting solder stirring zones according to the dimensional configuration of the semiconductor pellet supplied to a lead frame. SOLUTION: This mounter includes, along a transfer line 8 for intermittently guiding a lead frame 7 having islands and leads formed integrally, a notch groove making section 14 for making notch grooves 15 of a nearly ring shape in the islands by pushing projections 14a of a V-shaped section located nearly in a ring form counterposed to the islands against the islands, a solder supplying section 10 for supplying solder 11 onto the islands, a solder stirring section 12 for stirring the solder melted on the heated islands, and a semiconductor pellet supplying section 13 for supplying semiconductor pellets 2 onto the melted solder 11 sufficiently matched with the islands by the solder stirring section 12. Then operation of the notch groove making section 14 is controlled in association with the semiconductor pellets 2 supplied by the semiconductor pellet supplying section 13. |
