发明名称 DEVICE FOR DISSIPATING HEAT FROM AN ELECTRONIC COMPONENT FIXED IN A HOUSING
摘要 To dissipate heat from a lossy electronic component which is fixed to the inside of a housing wall, several of the external and/or internal sides of t he housing are placed into contact with a cooling element. In this way a large part or all of the housing surface can be used to dissipate lost heat to the surroundings.
申请公布号 CA2375590(A1) 申请公布日期 2000.12.07
申请号 CA20002375590 申请日期 2000.05.17
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 ZERBIAN, ERICH;KREUTZER, RAINER;JUNG, ROBERT
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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