发明名称 |
DEVICE FOR DISSIPATING HEAT FROM AN ELECTRONIC COMPONENT FIXED IN A HOUSING |
摘要 |
To dissipate heat from a lossy electronic component which is fixed to the inside of a housing wall, several of the external and/or internal sides of t he housing are placed into contact with a cooling element. In this way a large part or all of the housing surface can be used to dissipate lost heat to the surroundings.
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申请公布号 |
CA2375590(A1) |
申请公布日期 |
2000.12.07 |
申请号 |
CA20002375590 |
申请日期 |
2000.05.17 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
ZERBIAN, ERICH;KREUTZER, RAINER;JUNG, ROBERT |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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