| 摘要 |
<p>A laser is used to heat metallic components to be soldered, and a wavelength of the laser is chosen based in light absorption characteristics of the metallic components. A soldering location at which the laser forms a beam spot (515) is located at a predetermined distance away from a focus (513) of the laser beam, so that the beam spot (515) is defocused and has a uniform intensity across its area. The beam spot can be sized to simultaneously encompass a plurality of solder joint locations. The beam spot size and path across a plurality of solder joint locations are selected so that those portions of the solder joint locations which are touched by the beam have the same heat sinking properties. A camera is also provided coaxially with the laser beam, and a dichroic prism (509) is positioned between the laser beam and the camera.</p> |
